Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
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Publication:535756
DOI10.1016/S0020-7225(03)00217-9zbMATH Open1211.74203MaRDI QIDQ535756FDOQ535756
Authors: M. Stolarska, D. L. Chopp 
Publication date: 13 May 2011
Published in: International Journal of Engineering Science (Search for Journal in Brave)
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Cites Work
- Fronts propagating with curvature-dependent speed: Algorithms based on Hamilton-Jacobi formulations
- Elastic crack growth in finite elements with minimal remeshing
- A finite element method for crack growth without remeshing
- Modeling holes and inclusions by level sets in the extended finite element method
- Crack patterns in thin films
- Fast Marching Methods
- Modelling crack growth by level sets in the extended finite element method
- The fast construction of extension velocities in level set methods
- Non-planar 3D crack growth by the extended finite element and level sets-Part I: Mechanical model
- Fatigue crack propagation of multiple coplanar cracks with the coupled extended finite element/fast marching method
- Computing minimal surfaces via level set curvature flow
- A hybrid extended finite element/level set method for modeling phase transformations
Cited In (18)
- Modeling non-isothermal two-phase fluid flow with phase change in deformable fractured porous media using extended finite element method
- Effect of material irregularities on fatigue crack growth by enriched techniques
- Multiphysics computation of thermomechanical fatigue in electronics under electrical loading
- Multiscale modeling of degradation and failure of interconnect lines driven by electromigration and stress gradients
- Extended finite element modeling of fatigue crack growth microstructural mechanisms in alloys with secondary/reinforcing phases: model development and validation
- Crack reconstruction using a level-set strategy
- Kinetics of crack initiation and growth in organic-containing integrated structures
- Delamination in patterned films
- Propagation and bifurcation of cracks based on implicit surfaces and discontinuous velocities
- A method for multiple crack growth in brittle materials without remeshing
- Analysis of fatigue delamination growth in flip-chip package
- Finite element modeling of a microelectronic structure under uniform thermal loading.
- The extended/generalized finite element method: An overview of the method and its applications
- Extended layerwise method for laminated composite plates with multiple delaminations and transverse cracks
- A high-accuracy framework for phase-field fracture interface reconstructions with application to Stokes fluid-filled fracture surrounded by an elastic medium
- Boundary element analysis of cracked homogeneous or bi-material structures under thermo-mechanical cycling
- Hanging nodes and XFEM
- Crack propagation with the extended finite element method and a hybrid explicit-implicit crack description
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