Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method

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Publication:535756

DOI10.1016/S0020-7225(03)00217-9zbMath1211.74203MaRDI QIDQ535756

Magdalena A. Stolarska, David L. Chopp

Publication date: 13 May 2011

Published in: International Journal of Engineering Science (Search for Journal in Brave)




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