Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
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Publication:535756
DOI10.1016/S0020-7225(03)00217-9zbMath1211.74203MaRDI QIDQ535756
Magdalena A. Stolarska, David L. Chopp
Publication date: 13 May 2011
Published in: International Journal of Engineering Science (Search for Journal in Brave)
Related Items (10)
Crack propagation with the extended finite element method and a hybrid explicit-implicit crack description ⋮ Crack reconstruction using a level-set strategy ⋮ Extended layerwise method for laminated composite plates with multiple delaminations and transverse cracks ⋮ Propagation and bifurcation of cracks based on implicit surfaces and discontinuous velocities ⋮ A high-accuracy framework for phase-field fracture interface reconstructions with application to Stokes fluid-filled fracture surrounded by an elastic medium ⋮ Boundary element analysis of cracked homogeneous or bi-material structures under thermo-mechanical cycling ⋮ A method for multiple crack growth in brittle materials without remeshing ⋮ Hanging nodes and XFEM ⋮ Extended finite element modeling of fatigue crack growth microstructural mechanisms in alloys with secondary/reinforcing phases: model development and validation ⋮ The extended/generalized finite element method: An overview of the method and its applications
Cites Work
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- Modeling holes and inclusions by level sets in the extended finite element method
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