Delamination in patterned films
From MaRDI portal
Publication:869276
DOI10.1016/J.IJSOLSTR.2006.07.023zbMATH Open1107.74042OpenAlexW1993680282MaRDI QIDQ869276FDOQ869276
Authors: N. E. Zubov
Publication date: 2 March 2007
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2006.07.023
Recommendations
- Influence of interfacial delamination on channel cracking of elastic thin films
- Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
- Improved tri-layered interfacial stress model with the effect of different temperatures in the layers
- Cracking in thin multi-layers with finite-width and periodic architectures.
- Investigation of stress singularity fields and stress intensity factors for cracks
Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Thin films (74K35) Finite element methods applied to problems in solid mechanics (74S05) Fracture and damage (74R99)
Cited In (3)
This page was built for publication: Delamination in patterned films
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q869276)