Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756)
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scientific article; zbMATH DE number 5887932
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| English | Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method |
scientific article; zbMATH DE number 5887932 |
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Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (English)
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13 May 2011
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0.7299299240112305
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0.7267201542854309
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0.7118985652923584
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0.7003212571144104
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0.692703127861023
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