Pages that link to "Item:Q535756"
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The following pages link to Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756):
Displaying 10 items.
- Extended layerwise method for laminated composite plates with multiple delaminations and transverse cracks (Q341550) (← links)
- Propagation and bifurcation of cracks based on implicit surfaces and discontinuous velocities (Q600935) (← links)
- Boundary element analysis of cracked homogeneous or bi-material structures under thermo-mechanical cycling (Q643909) (← links)
- Crack reconstruction using a level-set strategy (Q834118) (← links)
- Extended finite element modeling of fatigue crack growth microstructural mechanisms in alloys with secondary/reinforcing phases: model development and validation (Q2033614) (← links)
- Crack propagation with the extended finite element method and a hybrid explicit-implicit crack description (Q2894968) (← links)
- Hanging nodes and XFEM (Q3006539) (← links)
- The extended/generalized finite element method: An overview of the method and its applications (Q3065648) (← links)
- A method for multiple crack growth in brittle materials without remeshing (Q5698785) (← links)
- A high-accuracy framework for phase-field fracture interface reconstructions with application to Stokes fluid-filled fracture surrounded by an elastic medium (Q6096429) (← links)
