Thermal stresses in bilayer systems with weak interface

DOI10.1016/J.MECHRESCOM.2010.07.005MaRDI QIDQ366562zbMATH OpenOpenAlexFDO

Authors D. Y. Liu, W. Q. Chen

Publication date 13 September 2013

Published in Mechanics Research Communications (Search for Journal in Brave)

Full work available at URL http://www.sciencedirect.com/science/article/pii/S0093641310000935

zbMATH Keywords

bilayer systemsStoney's formulathermal stressesweak interface

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05)

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Cites work

• A THEORY FOR ELASTIC STRESSES IN ADHESIVE BONDED LAP JOINTS
• Exact dynamic solutions to piezoelectric smart beams including peel stresses. I: Theory and application.
• Exact static solutions to piezoelectric smart beams including peel stresses. I: Theoretical formulation.
• Influence of imperfect interfaces on bending and vibration of laminated composite shells
• Interfacial Stresses in Bimetal Thermostats
• Substrate curvature due to thin film mismatch strain in the nonlinear deformation range
• Theory for Multilayered Anisotropic Plates With Weakened Interfaces
• Three-dimensional analysis of cross-ply laminated cylindrical panels with weak interfaces

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(10)

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• Diffusion-induced stresses in an imperfect bilayer electrode of coin-shaped lithium-ion batteries
• An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction
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• Thermal Stresses at the Edge of a Bimetallic Thermostat
• Interfacial Stresses in Bimetal Thermostats
• An Approximate Analysis of Stresses in Multilayered Elastic Thin Films
• New analytical model for thermomechanical responses of multi-layered structures with imperfect interfaces
• Electromechanical analysis of a piezoelectric semiconductor bilayer system with imperfect interface
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