Thermal stresses in bilayer systems with weak interface
From MaRDI portal
Publication:366562
DOI10.1016/j.mechrescom.2010.07.005zbMath1272.74135OpenAlexW1985801683MaRDI QIDQ366562
Mohammad Hasan, M. Dambrine, H. S. Yoon
Publication date: 13 September 2013
Published in: Mechanics Research Communications (Search for Journal in Brave)
Full work available at URL: http://www.sciencedirect.com/science/article/pii/S0093641310000935
Related Items
Diffusion-induced stresses in an imperfect bilayer electrode of coin-shaped lithium-ion batteries, New analytical model for thermomechanical responses of multi-layered structures with imperfect interfaces, Electromechanical analysis of a piezoelectric semiconductor bilayer system with imperfect interface, An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction
Cites Work
- Exact dynamic solutions to piezoelectric smart beams including peel stresses. I: Theory and application.
- Influence of imperfect interfaces on bending and vibration of laminated composite shells
- Three-dimensional analysis of cross-ply laminated cylindrical panels with weak interfaces
- Exact static solutions to piezoelectric smart beams including peel stresses. I: Theoretical formulation.
- Substrate curvature due to thin film mismatch strain in the nonlinear deformation range
- Interfacial Stresses in Bimetal Thermostats
- A THEORY FOR ELASTIC STRESSES IN ADHESIVE BONDED LAP JOINTS
- Theory for Multilayered Anisotropic Plates With Weakened Interfaces