An explicit elastic solution for a brittle film with periodic cracks

DOI10.1007/S10704-008-9286-3zbMATH Open1273.74486OpenAlexW2107532282MaRDI QIDQ373359FDOQ373359

Glaucio H. Paulino, W. G. Buttlar, H. M. Yin

Publication date: 22 October 2013

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-008-9286-3

Recommendations

• Periodic cracking of films supported on compliant substrates
• Boundary element analysis of cracked film-substrate media
• Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate
• Influence of interfacial delamination on channel cracking of elastic thin films
• Channel cracking in inelastic film/substrate systems

zbMATH Keywords

thin filmelastic materialsenergy release ratefracture toughnesschanneling crackperiodic cracks

Mathematics Subject Classification ID

Explicit solutions of equilibrium problems in solid mechanics (74G05) Thin films (74K35) Brittle fracture (74R10)

Cites Work

• Prediction of thermal crack spacing
• Crack patterns in thin films
• Mixed Mode Cracking in Layered Materials
• The damage tolerance of elastic-brittle, two-dimensional isotropic lattices
• Size effect on structural strength: A review
• The roles of toughness and cohesive strength on crack deflection at interfaces
• Interface crack between two shear deformable elastic layers
• Adiabatic decohesion in a thermoplastic craze thickening at constant or increasing rate

Cited In (8)

• Three-dimensional elastic analysis of a bi-material system with a single domain boundary element method
• The electro-mechanical response of highly compliant substrates and thin stiff films with periodic cracks
• A phase-field model of fracture with frictionless contact and random fracture properties: application to thin-film fracture and soil desiccation
• Boundary element analysis of cracked film-substrate media
• A variational model for fracture and debonding of thin films under in-plane loadings
• Elastic thermal stresses in a circular overlay/rigid substrate system
• Fracture of films caused by uniaxial tensions: a numerical model
• Fracture saturation and critical thickness in layered materials

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