scientific article; zbMATH DE number 1328877

MaRDI QIDQ4259891zbMATH OpenFDO

Authors Helcio R. B. Orlande, L. Dantas

Publication date 31 August 1999

zbMATH Keywords

eigenfunction expansioneigenvalue problemhybrid numerical-analytical integral transform approachinversion formulaprogram package DEVCRGsoftware Mathematicasymmetrical kernel

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05)

Review text

The authors apply hybrid numerical-analytical integral transform approach to solve the title problem important for modern electronic industry. First, an auxiliary eigenvalue problem is constructed and an integral transform pair with symmetrical kernel is defined, with inversion formula given by the corresponding eigenfunction expansion. Then the program package DEVCRG together with the software Mathematica is employed to obtain a convergent solution. The results are validated against available one-dimensional analytical solutions. For the entire collection see [Zbl 0906.00025].

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Cited in

(1)

• Explicit analytical solutions of non-Fourier heat conduction equation for IC chip

Describes a project that uses

Uses Software

• Mathematica

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