Monitoring Wafer Map Data from Integrated Circuit Fabrication Processes for Spatially Clustered Defects

DOI10.2307/1271129zbMath0891.62074OpenAlexW1969873259MaRDI QIDQ4355444

Mark H. Hansen, David J. Friedman, Vijayan N. Nair

Publication date: 25 June 1998

Full work available at URL: https://doi.org/10.2307/1271129

zbMATH Keywords

Markov random fieldquality improvementspatial clusteringstatistical process controlspatial randomnessintegrated circuit fabricationjoin-count statisticwafer yield

Mathematics Subject Classification ID

Inference from spatial processes (62M30) Random fields; image analysis (62M40) Applications of statistics in engineering and industry; control charts (62P30)

Related Items (4)

Model-based clustering for integrated circuit yield enhancement ⋮ Clustering partially masked images with modified Radon transformation ⋮ Adjacency-Clustering and Its Application for Yield Prediction in Integrated Circuit Manufacturing ⋮ Automatic identification of spatial defect patterns for semiconductor manufacturing

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