Wafer bin map recognition using a neural network approach

DOI10.1080/00207540210122275MaRDI QIDQ4468872zbMATH OpenOpenAlexFDO

Authors

Publication date 11 June 2004

Published in International Journal of Production Research (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1080/00207540210122275

zbMATH Keywords

defects

Mathematics Subject Classification ID

Case-oriented studies in operations research (90B90) Production models (90B30)

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Cites work

• scientific article; zbMATH DE number 976968 (Why is no real title available?)
• Detecting Spatial Effects from Factorial Experiments: An Application from Integrated-Circuit Manufacturing

Cited in

(4)

• Automatic identification of spatial defect patterns for semiconductor manufacturing
• A self-growing hidden Markov tree for wafer map inspection
• Error classification and yield prediction of chips in semiconductor industry applications.
• Advances in Neural Networks – ISNN 2005

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