Sequential Screening in Semiconductor Manufacturing, II: Exploiting Lot-to-Lot Variability

DOI10.1287/OPRE.44.1.196zbMATH Open0847.90072OpenAlexW4245148564MaRDI QIDQ4883213FDOQ4883213

Authors: Jihong Ou, Lawrence M. Wein 

Publication date: 13 October 1996

Published in: Operations Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1287/opre.44.1.196

Recommendations

• Sequential Screening in Semiconductor Manufacturing, I: Exploiting Spatial Dependence
• Note—Optimal Inspection Policy in Sequential Screening
• scientific article; zbMATH DE number 1740408
• Allocation of Chips to Wafers in a Production Problem of Semiconductor Kits

zbMATH Keywords

screeningquality managementempirical Bayes approachbad chips

Mathematics Subject Classification ID

Applications of statistics in engineering and industry; control charts (62P30) Inventory, storage, reservoirs (90B05) Production models (90B30)

Cited In (6)

• Knowledge acquisition from batch semiconductor manufacturing data
• Optimal reduction of a spatial monitoring grid: proposals and applications in process control
• Determining the optimal probing lot size for the wafer probe operation in semiconductor manufacturing
• Sequential Screening in Semiconductor Manufacturing, I: Exploiting Spatial Dependence
• Designing repetitive screening procedures with imperfect inspections: an empirical Bayes approach
• The effect of testing equipment shift on optimal decisions in a repetitive testing process

This page was built for publication: Sequential Screening in Semiconductor Manufacturing, II: Exploiting Lot-to-Lot Variability

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q4883213)