Experimental and analytical study on chip hot spot temperature

DOI10.1016/J.IJHEATMASSTRANSFER.2010.12.022MaRDI QIDQ547745zbMATH OpenOpenAlexFDO

Authors Chan Byon, Sung Jin Kim, Kyo Sung Choo

Publication date 24 June 2011

Published in International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijheatmasstransfer.2010.12.022

zbMATH Keywords

hot spot temperaturespreading resistance

Mathematics Subject Classification ID

Experimental work for problems pertaining to classical thermodynamics (80-05)

Recommendations

• Analysis of interfacial thermal stresses of chip-substrate structure
• Explicit analytical solutions of non-Fourier heat conduction equation for IC chip
• Thermal analysis and modeling of embedded processors
• Modeling thermal effects in submicron semiconductor devices
• Analysis of microchannel heat sinks for electronics cooling

This page was built for publication: Experimental and analytical study on chip hot spot temperature

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q547745)