Thermal analysis and modeling of embedded processors
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Publication:962603
DOI10.1016/J.COMPELECENG.2009.07.001zbMATH Open1191.68115OpenAlexW2093751778MaRDI QIDQ962603FDOQ962603
Authors: José L. Ayala, Cándido Méndez, Marisa López-Vallejo
Publication date: 7 April 2010
Published in: Computers and Electrical Engineering (Search for Journal in Brave)
Full work available at URL: http://oa.upm.es/8453/
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Cited In (8)
- Experimental and analytical study on chip hot spot temperature
- Thermal Modeling and Management of DRAM Systems
- Real-time worst-case temperature analysis with temperature-dependent parameters
- Development of the thermal analysis approach for portable electronic equipment
- Analysis and elimination of noise-induced temperature error in processor thermal control
- Modeling and control for thermal balancing of multi-core processors
- Probabilistic analysis of steady-state temperature and maximum frequency of multicore processors considering workload variation
- Title not available (Why is that?)
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