Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection

DOI10.1007/s00466-009-0399-yzbMath1398.74071OpenAlexW2017286370MaRDI QIDQ610410

Hisashi Tanie, Nobutada Ohno, Kazuhiko Nakane

Publication date: 8 December 2010

Published in: Computational Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00466-009-0399-y

zbMATH Keywords

constitutive behaviorlayered platescyclic thermal loadingthermal ratcheting

Mathematics Subject Classification ID

Plates (74K20) Small-strain, rate-independent theories of plasticity (including rigid-plastic and elasto-plastic materials) (74C05) Finite element methods applied to problems in solid mechanics (74S05) Thermal effects in solid mechanics (74F05) Plastic materials, materials of stress-rate and internal-variable type (74C99)

Cites Work

• Unnamed Item
• Thermal ratcheting of solder-bonded elastic and elastoplastic layers
• Kinematic hardening rules with critical state of dynamic recovery. I: Formulation and basic features for ratchetting behavior. II: Applications to experiments of ratchetting behavior
• Computational inelasticity
• Constitutive modeling of cyclic plasticity with emphasis on ratchetting
• Kinematic hardening model suitable for ratchetting with steady-state
• Plastic ratcheting induced cracks in thin film structures
• Ratchetting characteristics of 316FR steel at high temperature. II: Analysis of thermal ratchetting induced by spatial variation of temperature
• Implementation of cyclic plasticity models based on a general form of kinematic hardening

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