Chips on wafers, or packing rectangles into grids
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Publication:705545
DOI10.1016/J.COMGEO.2004.05.006zbMATH Open1066.65024OpenAlexW2155559020MaRDI QIDQ705545FDOQ705545
Authors: Mattias Andersson, Joachim Gudmundsson, Christos Levcopoulos
Publication date: 31 January 2005
Published in: Computational Geometry (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.comgeo.2004.05.006
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- A typology of cutting and packing problems
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- Recent advances on two-dimensional bin packing problems
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