Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components
From MaRDI portal
Publication:981289
DOI10.1016/J.IJHEATMASSTRANSFER.2005.10.001zbMATH Open1189.76604OpenAlexW2089801204MaRDI QIDQ981289FDOQ981289
Authors: J. Martínez 
Publication date: 30 June 2010
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2005.10.001
Recommendations
- Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
- A three-dimensional thermal-fluid analysis of flat heat pipes
- A mathematical model for analyzing the thermal characteristics of a flat micro heat pipe with a grooved wick
- An analytical model for fluid flow and heat transfer in a micro-heat pipe of polygonal shape
- Prediction of the temperature field in flat plate heat pipes with micro-grooves - experimental validation
Cited In (14)
- Generalized Brinkman-type fluid model and coupled heat conductivity problem
- On variation models of the irreversible processes in mechanics of solids and generalized hydrodynamics
- Applications and numerical simulations of heat pipe technologies in space thermal control system
- Two-phase simulations of micro heat pipes
- Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
- Analytical solution of Brinkman hydrodynamics in filtration problems
- A multi region adjoint-based solver for topology optimization in conjugate heat transfer problems
- Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe
- A three-dimensional thermal-fluid analysis of flat heat pipes
- Fluid flow and heat transfer in a dual-wet micro heat pipe
- An analytical model for fluid flow and heat transfer in a micro-heat pipe of polygonal shape
- Prediction of the temperature field in flat plate heat pipes with micro-grooves - experimental validation
- Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics
- Variational formulation of coupled hydrodynamic problems
This page was built for publication: Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q981289)
