Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components

DOI10.1016/J.IJHEATMASSTRANSFER.2005.10.001MaRDI QIDQ981289zbMATH OpenOpenAlexFDO

Authors J. Martínez

Publication date 30 June 2010

Published in International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijheatmasstransfer.2005.10.001

zbMATH Keywords

analytical modelmicro heat pipe

Mathematics Subject Classification ID

Flows in porous media; filtration; seepage (76S05)

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Cited in

(14)

• Generalized Brinkman-type fluid model and coupled heat conductivity problem
• On variation models of the irreversible processes in mechanics of solids and generalized hydrodynamics
• Applications and numerical simulations of heat pipe technologies in space thermal control system
• Two-phase simulations of micro heat pipes
• Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
• Analytical solution of Brinkman hydrodynamics in filtration problems
• A multi region adjoint-based solver for topology optimization in conjugate heat transfer problems
• Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe
• A three-dimensional thermal-fluid analysis of flat heat pipes
• Fluid flow and heat transfer in a dual-wet micro heat pipe
• An analytical model for fluid flow and heat transfer in a micro-heat pipe of polygonal shape
• Prediction of the temperature field in flat plate heat pipes with micro-grooves - experimental validation
• Variational formulation of coupled hydrodynamic problems
• Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics

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