Dynamic delamination of patterned thin films: a numerical study

DOI10.1007/S10704-010-9460-2zbMATH Open1425.74308OpenAlexW2096738480MaRDI QIDQ989726FDOQ989726

Authors: J. Martínez 

Publication date: 23 August 2010

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-010-9460-2

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zbMATH Keywords

thin filmdelaminationdynamic fracturefracture toughnesscohesive modelbeam modellaser spallation

Mathematics Subject Classification ID

Thin films (74K35) Experimental work for problems pertaining to mechanics of deformable solids (74-05) Fracture and damage (74R99)

Cites Work

• Finite-deformation irreversible cohesive elements for three-dimensional crack-propagation analysis
• Failure of microelectromechanical systems subjected to impulse loads
• Applications of higher order corotational stretch theories to nonlinear finite element analysis

Cited In (6)

• Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate
• A theoretical and numerical study of thin film delamination using the pull-off test
• Destruction of thin films with damaged substrate as a result of waves localization
• Dynamic buckling delamination of a bonded thin film under residual compression
• In-situ characterization of interface delamination by a new miniature mixed mode bending setup
• Title not available (Why is that?)

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