Failure of microelectromechanical systems subjected to impulse loads

DOI10.1016/J.IJSOLSTR.2007.08.004MaRDI QIDQ833902zbMATH OpenOpenAlexFDO

Authors I. Chasiotis, Jason S. Kimberley, J. Lambros

Publication date 14 August 2009

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijsolstr.2007.08.004

zbMATH Keywords

dynamicinterfacefailureimpact

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

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Cites work

• Fracture Toughness and Subcritical Crack Growth in Polycrystalline Silicon
• The order of stress singularity near the vertex in three-dimensional joints

Cited in

(8)

• Predictions of strength in MEMS components with defects --- a novel experimental--theoretical approach
• Stress-driven morphological instability and catastrophic failure of microdevices.
• Dynamic delamination of patterned thin films: a numerical study
• Mechanics of energy transfer and failure of ductile microscale beams subjected to dynamic loading
• Dynamic response of electronic materials to impact loading: review
• A three-scale FE approach to reliability analysis of MEMS sensors subject to impacts
• Monte Carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks
• Initial study on the drop-impact behavior of mini Hi-Fi audio products

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