Failure of microelectromechanical systems subjected to impulse loads

DOI10.1016/J.IJSOLSTR.2007.08.004zbMATH Open1167.74311OpenAlexW2065602570MaRDI QIDQ833902FDOQ833902

Authors: I. Chasiotis, Jason S. Kimberley, J. Lambros 

Publication date: 14 August 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2007.08.004

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zbMATH Keywords

dynamicinterfacefailureimpact

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

Cites Work

• The order of stress singularity near the vertex in three-dimensional joints
• Fracture Toughness and Subcritical Crack Growth in Polycrystalline Silicon

Cited In (7)

• Predictions of strength in MEMS components with defects --- a novel experimental--theoretical approach
• Stress-driven morphological instability and catastrophic failure of microdevices.
• Dynamic delamination of patterned thin films: a numerical study
• Mechanics of energy transfer and failure of ductile microscale beams subjected to dynamic loading
• Dynamic response of electronic materials to impact loading: review
• A three-scale FE approach to reliability analysis of MEMS sensors subject to impacts
• Initial study on the drop-impact behavior of mini Hi-Fi audio products

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