Pages that link to "Item:Q2385834"
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The following pages link to The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane (Q2385834):
Displaying 11 items.
- Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips (Q363700) (← links)
- Mode III fracture of an arbitrary oriented crack in two dimensional functionally graded material (Q366687) (← links)
- Three-dimensional mixed-mode stress intensity factors for cracks in functionally graded materials using enriched finite elements (Q545033) (← links)
- Crack tip shielding and anti-shielding effects of the imperfect interface in a layered piezoelectric sensor (Q546649) (← links)
- Transient heat conduction in a functionally graded strip in contact with well stirred fluid with an outside heat source (Q656751) (← links)
- Analysis of a mode III crack problem in a functionally graded coating-substrate system with finite thickness (Q712409) (← links)
- Mode III fracture problem of an arbitrarily oriented crack in a FGPM strip bonded to a FGPM half plane (Q838546) (← links)
- Effects of the weak/micro-discontinuity of interface on the fracture behavior of a functionally graded coating with an inclined crack (Q1041471) (← links)
- Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane (Q1937621) (← links)
- In-plane stress analysis of dissimilar materials with multiple interface cracks (Q2293485) (← links)
- Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials (Q2428324) (← links)