Pages that link to "Item:Q5525942"
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The following pages link to Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium (Q5525942):
Displaying 5 items.
- Analytical solution for a reinforcement layer bonded to an elliptic hole under a remote uniform load (Q837779) (← links)
- Stresses in an orthotropic strip containing a Griffith crack (Q1244872) (← links)
- Thermal stresses around a ribbon-like inclusion in a semi-infinite medium under uniform heat flow (Q1257776) (← links)
- A new thermoelectroelastic solution for piezoelectric materials with various openings (Q1818657) (← links)
- Thermally neutral nano-hole and its effect on the elastic field (Q2307811) (← links)
