The following pages link to E. Suhir (Q1198261):
Displayed 18 items.
- Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards, used in avionic packaging (Q1198262) (← links)
- Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics (Q1279454) (← links)
- Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains (Q1290005) (← links)
- Approximate evaluation of the interfacial shearing stress in cylindrical double lap shear joints with application to dual-coated optical fibers (Q1291412) (← links)
- Adhesively bonded assemblies with identical nondeformable adeherends and `piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive (Q1573017) (← links)
- Analysis of a bi-material strip (Q2883226) (← links)
- Bending of a bi-material cantilever beam, with consideration of the role of the interfacial shearing stress (Q2905253) (← links)
- Analysis of a pre-stressed bi-material accelerated-life-test (ALT) specimen (Q3004170) (← links)
- Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (Q3076990) (← links)
- Interfacial Stresses in Bimetal Thermostats (Q3495712) (← links)
- An Approximate Analysis of Stresses in Multilayered Elastic Thin Films (Q3814908) (← links)
- Thermally Induced Interfacial Stresses in Elongated Bimaterial Plates (Q4017328) (← links)
- Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to its Support Contour (Q4021863) (← links)
- Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends (Q4362339) (← links)
- Analysis of an elongated stretched strip, with application to a strain‐gage electrical sensor design (Q5392928) (← links)
- Aerospace electronics reliability prediction: application of two advanced probabilistic techniques (Q6064422) (← links)
- Dynamic response of electronic materials to impact loading: review (Q6066695) (← links)
- Avoiding inelastic strains in solder joint interconnections of space electronics (Q6121027) (← links)