Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756): Difference between revisions

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+MaRDI publication profile
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+Crack patterns in thin films
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+A finite element method for crack growth without remeshing
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+Modelling crack growth by level sets in the extended finite element method
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+Fast Marching Methods
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+Modeling holes and inclusions by level sets in the extended finite element method
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+Non-planar 3D crack growth by the extended finite element and level sets-Part I: Mechanical model
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+Fatigue crack propagation of multiple coplanar cracks with the coupled extended finite element/fast marching method
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+A hybrid extended finite element/level set method for modeling phase transformations
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+Elastic crack growth in finite elements with minimal remeshing
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+The fast construction of extension velocities in level set methods
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+Computing minimal surfaces via level set curvature flow
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