Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756): Difference between revisions

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Property / author: Magdalena A. Stolarska / rank
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Property / author: David L. Chopp / rank
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Property / author: Magdalena A. Stolarska / rank
 
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Property / author: David L. Chopp / rank
 
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Latest revision as of 00:51, 4 July 2024

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Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
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