Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756): Difference between revisions
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Revision as of 02:10, 20 February 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method |
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Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (English)
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13 May 2011
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