Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144): Difference between revisions
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scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor |
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Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (English)
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3 September 2021
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piezoelectric semiconductor
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penny-shaped crack
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semi-permeable boundary condition
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extended stress intensity factors
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