Thermal and residual stresses of Czochralski-grown semiconducting material (Q1067813): Difference between revisions
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Latest revision as of 01:26, 20 March 2024
scientific article
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English | Thermal and residual stresses of Czochralski-grown semiconducting material |
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Thermal and residual stresses of Czochralski-grown semiconducting material (English)
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1986
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The thermal stresses during pulling and the residual stresses after pulling in a Czochralski-grown semiconducting crystal are obtained analytically by using an isotropic thermoelastic model. It is assumed that a finite cylindrical crystal is withdrawn from a melt with a constant pulling rate, and the physical properties of crystal are independent of temperature. Moreover the problem is considered to be a quasi-stationary one. Numerical results show that the Biot number is a prime factor affecting the thermal and residual stresses. The differences between the models of the finite crystal and semi-infinite crystal are described. An explanation of the experimental results is attempted.
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stresses strongly affected by Biot number
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thermal stresses during pulling
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residual stresses after pulling
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Czochralski-grown semiconducting crystal
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isotropic thermoelastic model
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quasi-stationary
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finite crystal
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semi-infinite crystal
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