Pages that link to "Item:Q1655061"
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The following pages link to Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method (Q1655061):
Displayed 9 items.
- Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor (Q1655978) (← links)
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors (Q1788375) (← links)
- Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144) (← links)
- Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings (Q2223897) (← links)
- Nonlinear solutions of PN junctions of piezoelectric semiconductors (Q2285507) (← links)
- A modified singular boundary method for three-dimensional high frequency acoustic wave problems (Q2295064) (← links)
- Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. I: Theoretical solutions (Q2295292) (← links)
- Extension of a piezoelectric semiconductor fiber with consideration of electrical nonlinearity (Q2296369) (← links)
- BEM analysis for curved cracks (Q2662434) (← links)