Pages that link to "Item:Q1873405"

The following pages link to Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405):

Displaying 7 items.

• A parametric finite element method for fourth order geometric evolution equations (Q870630) (← links)
• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
• Grain boundary migration with thermal grooving effects: a numerical approach (Q1691855) (← links)
• A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
• An energy stable finite difference method for anisotropic surface diffusion on closed curves (Q2077039) (← links)
• A structure‐preserving finite element approximation of surface diffusion for curve networks and surface clusters (Q6090444) (← links)
• Parametric finite element approximations for anisotropic surface diffusion with axisymmetric geometry (Q6119266) (← links)