Pages that link to "Item:Q1968692"

The following pages link to Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692):

Displaying 9 items.

• Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\) (Q600929) (← links)
• Finite element approximation of a three dimensional phase field model for void electromigration (Q618416) (← links)
• From Bell shapes to pyramids: a reduced continuum model for self-assembled quantum dot growth (Q964907) (← links)
• Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires (Q1025204) (← links)
• Simulations of the spreading of a vesicle on a substrate surface mediated by receptor-ligand binding (Q1025783) (← links)
• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
• Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
• Numerical simulations of island formation in a coherent strained epitaxial thin film system (Q1975874) (← links)
• A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids (Q5939627) (← links)