Pages that link to "Item:Q2191601"
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The following pages link to A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601):
Displaying 4 items.
- Thermal analysis of electronic packaging structure using isogeometric boundary element method (Q2040778) (← links)
- The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure (Q2127930) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems (Q6539835) (← links)
