Computation of Two-phase Flow in Flip-chip Packaging Using Level Set Method

DOI10.1007/978-3-642-14438-7_15MaRDI QIDQ4961225zbMATH OpenOpenAlexFDO

Authors Tomohisa Hashimoto, Keiichi Saito, Koji Morinishi, Nobuyuki Satofuka

Publication date 26 October 2018

Published in Lecture Notes in Computational Science and Engineering (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/978-3-642-14438-7_15

Mathematics Subject Classification ID

Finite difference methods applied to problems in fluid mechanics (76M20) Liquid-gas two-phase flows, bubbly flows (76T10)

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Cites work

• A continuum method for modeling surface tension
• A level set approach for computing solutions to incompressible two-phase flow
• scientific article; zbMATH DE number 2226862 (Why is no real title available?)
• Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
• Upwind differencing scheme for the time-accurate incompressible Navier-Stokes equations

Cited in

(4)

• Numerical simulation of underfill encapsulation process based on characteritsic split method
• The effective permeability of the underfill flow domain in flip-chip packaging
• Three-dimensional simulation of underfill process in flip-chip encapsulation
• Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

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