Numerical simulation of underfill encapsulation process based on characteritsic split method

DOI10.1002/NME.1704MaRDI QIDQ3440507zbMATH OpenOpenAlexFDO

Authors Venkatesh M. Kulkarni, Kankanhalli N. Seetharamu, I. A. Azid, P. A. Aswatha Narayana, G. A. Quadir

Publication date 22 May 2007

Published in International Journal for Numerical Methods in Engineering (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1002/nme.1704

zbMATH Keywords

characteristic based split (CBS) methodfinite element method (FEM)front trackingsimulationunderfill encapsulationvolume of fluid technique (VOF)

Mathematics Subject Classification ID

Non-Newtonian fluids (76A05) Finite element methods applied to problems in fluid mechanics (76M10)

Recommendations

• Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
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Cites work

• The effects of Brownian rotations in a dilute suspension of rigid particles of arbitrary shape

Cited in

(4)

• The effective permeability of the underfill flow domain in flip-chip packaging
• Three-dimensional simulation of underfill process in flip-chip encapsulation
• Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
• Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process

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