The effective permeability of the underfill flow domain in flip-chip packaging

DOI10.1016/J.APM.2012.03.036MaRDI QIDQ350443zbMATH OpenOpenAlexFDO

Authors Connie Yang, Wen-Bin Young

Publication date 7 December 2016

Published in Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.apm.2012.03.036

zbMATH Keywords

capillary flowflip-chippower-law fluidunderfill

Mathematics Subject Classification ID

Capillarity (surface tension) for incompressible inviscid fluids (76B45)

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Cited in

(3)

• Numerical simulation of underfill encapsulation process based on characteritsic split method
• Three-dimensional simulation of underfill process in flip-chip encapsulation
• Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

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