Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model (Q1313188)
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English | Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model |
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Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model (English)
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26 January 1994
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For a board of thermally active electronic devices a mathematical model is presented which simulates the evolution of its thermal state. Heat exchange among the components themselves as well as between the components, the edges and a convective flow of cool air is considered, thus giving rise to two discrete systems of equations. The heat exchange between air and board is assumed to satisfy a linear equation. Existence and uniqueness of a steady state solution are proven. Numerical results are obtained by using a non-deterministic scheme, the annealing algorithm.
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convective cooling
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electronic boards
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optimal placement
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numerical results
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annealing algorithm
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