EFFICIENT SIMULATION OF 3‐D STRESS DISTRIBUTIONS AT TRENCH STRUCTURES CAUSED BY THERMAL MISMATCH OF TRENCH FILLING AND SILICON SUBSTRATE (Q4835974)
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scientific article; zbMATH DE number 762208
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| English | EFFICIENT SIMULATION OF 3‐D STRESS DISTRIBUTIONS AT TRENCH STRUCTURES CAUSED BY THERMAL MISMATCH OF TRENCH FILLING AND SILICON SUBSTRATE |
scientific article; zbMATH DE number 762208 |
Statements
EFFICIENT SIMULATION OF 3‐D STRESS DISTRIBUTIONS AT TRENCH STRUCTURES CAUSED BY THERMAL MISMATCH OF TRENCH FILLING AND SILICON SUBSTRATE (English)
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5 July 1995
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analytical solution
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rectangular parallelepipedic trench
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0.713459312915802
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0.70026034116745
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0.6963743567466736
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0.6829766631126404
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