3-D finite element simulation of wafer thermal distortion and stress fields in exposure process (Q5956667)
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scientific article; zbMATH DE number 1713161
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| English | 3-D finite element simulation of wafer thermal distortion and stress fields in exposure process |
scientific article; zbMATH DE number 1713161 |
Statements
3-D finite element simulation of wafer thermal distortion and stress fields in exposure process (English)
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22 July 2002
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Exposure
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Finite element method
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Wafer
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Thermal deformation
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Thermal stress
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0.6866481900215149
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0.6841313242912292
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0.6786152720451355
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0.6783138513565063
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