The method of analysis of cracks in three-dimensional transversely isotropic media: Boundary intergral equation approach
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Cites work
- scientific article; zbMATH DE number 4018452 (Why is no real title available?)
- scientific article; zbMATH DE number 3694731 (Why is no real title available?)
- scientific article; zbMATH DE number 3488788 (Why is no real title available?)
- scientific article; zbMATH DE number 3048132 (Why is no real title available?)
- Complete solution to the problem of an external circular crack in a transversely isotropic body subjected to arbitrary shear loading
- On Some Problems in Transversely Isotropic Elastic Materials
- Solution of plane elasticity problems by the displacement discontinuity method. I. Infinite body solution
- Stress state of a transversally isotropic medium with a parabolic crack under a linearly varying shear load
- Stress state of transversally isotropic body with elliptical crack in the presence of a uniform heat flux at its surface
- THE TRANSFORMATION TO ISOTROPIC FORM OF THE EQUILIBRIUM EQUATIONS FOR A CLASS OF ANISOTROPIC ELASTIC SOLIDS
Cited in
(16)- Analysis of cracked transversely isotropic and inhomogeneous solids by a special BIE formulation
- Stress intensity factors of square cracks in one-layered transversely isotropic halfspaces subject to internal expansion or tensile traction
- Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure
- Weakly-singular, weak-form integral equations for cracks in three-dimensional anisotropic media
- Time-harmonic and static crack problems in 3-D transversely isotropic bodies
- Three-dimensional stress intensity factors of a central square crack in a transversely isotropic cuboid with arbitrary material orientations
- Dugdale model solutions for a penny-shaped crack in three-dimensional transversely isotropic piezoelectric media by boundary integral equation method
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
- Analysis method of planar cracks of arbitrary shape in the isotropic plane of a three-dimensional transversely isotropic magnetoelectroelastic medium
- Three-dimensional thermo-electro-elastic field in one-dimensional hexagonal piezoelectric quasi-crystal weakened by an elliptical crack
- BIEM for 2D steady-state problems in cracked anisotropic materials
- Three-dimensional analysis of cracks in layered transversely isotropic media
- Boundary integral equation method for conductive cracks in two and three-dimensional transversely isotropic piezoelectric media
- New approach to interface crack problems in transversely isotropic materials
- Boundary element formulation for 3D transversely isotropic cracked bodies
- Boundary element analysis of three-dimensional crack problems in two joined transversely isotropic solids
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