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Effect of RF-discharge on silicon etching in CF₄/O₂

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Publication:3056643
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zbMATH Open1201.76239MaRDI QIDQ3056643FDOQ3056643


Authors: A. G. Gorobchuk, Yu. N. Grigor'ev Edit this on Wikidata


Publication date: 12 November 2010





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  • scientific article; zbMATH DE number 1353949
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  • Three-dimensional discharge simulation of inductively coupled plasma (ICP) etching reactor
  • ETCH PROFILE EVOLUTION IN LOW PRESSURE RF PLASMA WITH AXIAL MAGNETIC FIELD
  • The Behaviour of the Etching Rate in a Model of Plasma Etching


zbMATH Keywords

plasma etchingion etchersilicon etching


Mathematics Subject Classification ID

Rarefied gas flows, Boltzmann equation in fluid mechanics (76P05) Statistical mechanics of plasmas (82D10)



Cited In (2)

  • ETCH PROFILE EVOLUTION IN LOW PRESSURE RF PLASMA WITH AXIAL MAGNETIC FIELD
  • Three-dimensional discharge simulation of inductively coupled plasma (ICP) etching reactor





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