Analytical solution for Polish-rate decay in chemical--mechanical polishing

DOI10.1007/S10665-010-9369-9MaRDI QIDQ718931zbMATH OpenOpenAlexFDO

Authors Hong Shi, Terry A. Ring

Publication date 27 September 2011

Published in Journal of Engineering Mathematics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s10665-010-9369-9

zbMATH Keywords

pad asperitypolymer wear

Mathematics Subject Classification ID

Chemical and reactive effects in solid mechanics (74F25) Explicit solutions of dynamical problems in solid mechanics (74H05)

Recommendations

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Cites work

• A theory of pad conditioning for chemical-mechanical polishing
• Mathematical modeling of polish-rate decay in chemical-mechanical polishing

Cited in

(7)

• Modeling and calculation of slurry-chemistry effects on chemical-mechanical planarization with a grooved pad
• Mathematical modeling of polish-rate decay in chemical-mechanical polishing
• Acid polishing of lead glass
• Stochastic models for pad structure and pad conditioning used in chemical-mechanical polishing
• A theory of pad conditioning for chemical-mechanical polishing
• High-accuracy polishing technique using dwell time adjustment.
• A model for chemical-mechanical polishing of a material surface based on contact mechanics

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