Pages that link to "Item:Q1027930"
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The following pages link to A three-scale FE approach to reliability analysis of MEMS sensors subject to impacts (Q1027930):
Displaying 3 items.
- A domain decomposition approach for the simulation of fracture phenomena in polycrystalline microsystems (Q1667283) (← links)
- Monte Carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks (Q2439195) (← links)
- Sensitivity, probabilistic and stochastic analysis of the thermo-piezoelectric phenomena in solids by the stochastic perturbation technique (Q2443553) (← links)
