Pages that link to "Item:Q1958304"
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The following pages link to BEM calculation of the complex thermal impedance of microelectronic devices (Q1958304):
Displayed 3 items.
- BEM calculation of the complex thermal impedance of microelectronic devices (Q1958304) (← links)
- The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure (Q2127930) (← links)
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601) (← links)