Pages that link to "Item:Q5937908"

The following pages link to Computation for electromigration in interconnects of microelectronic devices (Q5937908):

Displaying 6 items.

• A fitted finite element method for the numerical approximation of void electro-stress migration (Q268875) (← links)
• The level-set method applied to droplet dynamics in the presence of an electric field (Q416717) (← links)
• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
• A numerical model of stress driven grain boundary diffusion. (Q1418699) (← links)
• Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
• An unfitted finite element method for the numerical approximation of void electromigration (Q2517475) (← links)