Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964): Difference between revisions
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Revision as of 10:24, 9 December 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces |
scientific article |
Statements
Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (English)
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14 August 2009
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computer simulations
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models of non-equilibrium phenomena
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surface diffusion
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surface morphology
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electromigration
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grain boundary grooving
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cathode drift
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