Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964)
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scientific article; zbMATH DE number 5595598
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| English | Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces |
scientific article; zbMATH DE number 5595598 |
Statements
Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (English)
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14 August 2009
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computer simulations
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models of non-equilibrium phenomena
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surface diffusion
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surface morphology
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electromigration
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grain boundary grooving
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cathode drift
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0.765519380569458
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0.7384390234947205
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0.730796217918396
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0.7296727895736694
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0.7270110249519348
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