Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
DOI10.1016/J.IJSOLSTR.2007.09.007zbMATH Open1167.74406OpenAlexW1984806010MaRDI QIDQ833964FDOQ833964
Authors: Tarik Omer Ogurtani, Oncu Akyildiz 
Publication date: 14 August 2009
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2007.09.007
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computer simulationssurface diffusioncathode driftelectromigrationgrain boundary groovingmodels of non-equilibrium phenomenasurface morphology
Cites Work
- Numerical simulation of grain-boundary grooving by level set method
- Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
- Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
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