Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

DOI10.1016/J.IJSOLSTR.2007.09.007MaRDI QIDQ833964zbMATH OpenOpenAlexFDO

Authors Tarik Omer Ogurtani, Oncu Akyildiz

Publication date 14 August 2009

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijsolstr.2007.09.007

zbMATH Keywords

computer simulationssurface diffusioncathode driftelectromigrationgrain boundary groovingmodels of non-equilibrium phenomenasurface morphology

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

Recommendations

• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects
• A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
• Electromigration of intergranular voids in metal films for microelectronic interconnects.
• Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
• Creep flow, diffusion, and electromigration in small scale interconnects

Cites work

• Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
• Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
• Numerical simulation of grain-boundary grooving by level set method

Cited in

(2)

• Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
• Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects

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