Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964): Difference between revisions
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| Property / DOI: 10.1016/J.IJSOLSTR.2007.09.007 / rank | |||
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| Property / DOI: 10.1016/J.IJSOLSTR.2007.09.007 / rank | |||
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Latest revision as of 04:36, 10 December 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces |
scientific article |
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Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (English)
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14 August 2009
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computer simulations
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models of non-equilibrium phenomena
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surface diffusion
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surface morphology
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electromigration
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grain boundary grooving
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cathode drift
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