Pages that link to "Item:Q4013294"
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The following pages link to Mixed Mode Cracking in Layered Materials (Q4013294):
Displayed 50 items.
- A thermomechanical fracture modeling and simulation for functionally graded solids using a residual-strain formulation (Q373286) (← links)
- An explicit elastic solution for a brittle film with periodic cracks (Q373359) (← links)
- Stress intensity factor for a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation (Q396179) (← links)
- Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate (Q399036) (← links)
- An enhanced beam-theory model of the mixed-mode bending (MMB) test. II: Applications and results (Q399758) (← links)
- Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate (Q405037) (← links)
- Steady-state mode III delamination crack in a periodically layered medium (Q407692) (← links)
- Progressive frictional delamination of an infinite elastic film on a rigid substrate due to in-plane point loading (Q438915) (← links)
- Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005) (← links)
- Boussinesq type solution for a transversely isotropic half-space coated with a thin film (Q531557) (← links)
- Mathematical modeling and numerical simulation of telephone cord buckles of elastic films (Q544854) (← links)
- Strength scaling of adhesive joints in polymer-matrix composites (Q545025) (← links)
- Interface crack in sandwich specimen (Q602074) (← links)
- Stress intensity factors for an interface kinked crack in a bi-material plate loaded normal to the interface (Q604312) (← links)
- Buckling delamination of a rectangular plate containing a rectangular crack and made from elastic and viscoelastic composite materials (Q619976) (← links)
- Evaluation of mixed mode stress intensity factors for interface cracks using EFGM (Q638875) (← links)
- Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles (Q651924) (← links)
- A wedge crack in an anisotropic material under antiplane shear (Q660549) (← links)
- On the calculation of energy release rates for cracked laminates with residual stresses (Q712371) (← links)
- Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique (Q712386) (← links)
- Self-driven tunneling crack arrays -- a 3D-fracture mechanics bifurcation analysis (Q712401) (← links)
- Crack paths and the problem of global directional stability (Q712415) (← links)
- Analysis of three-dimensional interface cracks using enriched finite element (Q712445) (← links)
- T-stress of a bi-material strip under generalized edge loads (Q712450) (← links)
- On the toughening of brittle materials by grain bridging: promoting intergranular fracture through grain angle, strength, and toughness (Q731076) (← links)
- A unified model for stress-driven rearrangement instabilities (Q776901) (← links)
- Investigating propagation path of interface crack by the field-enriched finite element method (Q821759) (← links)
- Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. II. Application to inxga1 - xas/InP system (Q833941) (← links)
- Laws of crack motion and phase-field models of fracture (Q835859) (← links)
- Delamination of compressed thin layers at corners (Q835967) (← links)
- Using a cohesive damage model to predict the tensile behaviour of CFRP single-strap repairs (Q837230) (← links)
- Nonlinear fracture mechanics of flexural-shear crack induced debonding of FRP strengthened concrete beams (Q837277) (← links)
- An exact theory of interfacial debonding in layered elastic composites (Q837809) (← links)
- Interaction between cracking, delamination and buckling in brittle elastic thin films (Q841923) (← links)
- Effect of domain switching on kinking of a crack in a ferroelectric material (Q857511) (← links)
- Finite element simulation of stress intensity factors in elastic plastic crack growth (Q863859) (← links)
- Numerical studies on crack problems in three-layered elastic media using an image method (Q865147) (← links)
- The energy release rate of mode II fractures in layered snow samples (Q865178) (← links)
- On the fracture resistance of adhesively jointing structures (Q869233) (← links)
- A variational model for fracture and debonding of thin films under in-plane loadings (Q904783) (← links)
- Effect of a transverse electric field on crack kinking in ferroelectric ceramics (Q954237) (← links)
- Free-edge stresses and progressive cracking in surface coatings of circular torsion bars (Q957425) (← links)
- Fracture saturation and critical thickness in layered materials (Q991662) (← links)
- Peeling behavior of a bio-inspired nano-film on a substrate (Q994708) (← links)
- Analysis of hollow inclusion-matrix debonding in particulate composites (Q994748) (← links)
- A micromechanical basis for partitioning the evolution of grain bridging in brittle materials (Q1019326) (← links)
- Nonlinear analyses of wrinkles in a film bonded to a compliant substrate (Q1019383) (← links)
- Deflection criterion of a crack approaching a bi-material interface obliquely (Q1020403) (← links)
- Wrinkling of a charged elastic film on a viscous layer (Q1021228) (← links)
- Mode III effects on interface delamination (Q1025282) (← links)