Pages that link to "Item:Q4013294"

The following pages link to Mixed Mode Cracking in Layered Materials (Q4013294):

Displaying 50 items.

• Fracture and debonding of a thin film on a stiff substrate: analytical and numerical solutions of a one-dimensional variational model (Q304135) (← links)
• SIF-based fracture criterion for interface cracks (Q332881) (← links)
• Fundamental solutions for singularities within a layered solid (Q340200) (← links)
• Effect of residual stresses on the propagation of interface cracks between dissimilar brittle materials: contribution of two and three-dimensional analyses (Q340211) (← links)
• BEM solution of delamination problems using an interface damage and plasticity model (Q360309) (← links)
• High-fidelity simulations of multiple fracture processes in a laminated composite in tension (Q361414) (← links)
• Periodic cracking of films supported on compliant substrates (Q361482) (← links)
• Stress singularities in a periodically layered composite with a transverse rigid line inclusion (Q363050) (← links)
• A generalized Weibull approach to interface failure in bi-material ceramic joints (Q364785) (← links)
• Adhesive lap-joints: a micro-scale numerical investigation (Q366422) (← links)
• Elastic thermal stresses in a circular overlay/rigid substrate system (Q366716) (← links)
• A thermomechanical fracture modeling and simulation for functionally graded solids using a residual-strain formulation (Q373286) (← links)
• An explicit elastic solution for a brittle film with periodic cracks (Q373359) (← links)
• Stress intensity factor for a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation (Q396179) (← links)
• Effect of elastic constants on crack channeling in a thin film bonded to an orthotropic substrate (Q399036) (← links)
• An enhanced beam-theory model of the mixed-mode bending (MMB) test. II: Applications and results (Q399758) (← links)
• Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate (Q405037) (← links)
• Steady-state mode III delamination crack in a periodically layered medium (Q407692) (← links)
• Progressive frictional delamination of an infinite elastic film on a rigid substrate due to in-plane point loading (Q438915) (← links)
• Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005) (← links)
• Boussinesq type solution for a transversely isotropic half-space coated with a thin film (Q531557) (← links)
• Mathematical modeling and numerical simulation of telephone cord buckles of elastic films (Q544854) (← links)
• Strength scaling of adhesive joints in polymer-matrix composites (Q545025) (← links)
• Interface crack in sandwich specimen (Q602074) (← links)
• Stress intensity factors for an interface kinked crack in a bi-material plate loaded normal to the interface (Q604312) (← links)
• Buckling delamination of a rectangular plate containing a rectangular crack and made from elastic and viscoelastic composite materials (Q619976) (← links)
• Evaluation of mixed mode stress intensity factors for interface cracks using EFGM (Q638875) (← links)
• Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles (Q651924) (← links)
• A wedge crack in an anisotropic material under antiplane shear (Q660549) (← links)
• On the calculation of energy release rates for cracked laminates with residual stresses (Q712371) (← links)
• Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique (Q712386) (← links)
• Self-driven tunneling crack arrays -- a 3D-fracture mechanics bifurcation analysis (Q712401) (← links)
• Crack paths and the problem of global directional stability (Q712415) (← links)
• Analysis of three-dimensional interface cracks using enriched finite element (Q712445) (← links)
• T-stress of a bi-material strip under generalized edge loads (Q712450) (← links)
• On the toughening of brittle materials by grain bridging: promoting intergranular fracture through grain angle, strength, and toughness (Q731076) (← links)
• A unified model for stress-driven rearrangement instabilities (Q776901) (← links)
• Investigating propagation path of interface crack by the field-enriched finite element method (Q821759) (← links)
• Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate. II. Application to inxga1 - xas/InP system (Q833941) (← links)
• Laws of crack motion and phase-field models of fracture (Q835859) (← links)
• Delamination of compressed thin layers at corners (Q835967) (← links)
• Using a cohesive damage model to predict the tensile behaviour of CFRP single-strap repairs (Q837230) (← links)
• Nonlinear fracture mechanics of flexural-shear crack induced debonding of FRP strengthened concrete beams (Q837277) (← links)
• An exact theory of interfacial debonding in layered elastic composites (Q837809) (← links)
• Interaction between cracking, delamination and buckling in brittle elastic thin films (Q841923) (← links)
• Effect of domain switching on kinking of a crack in a ferroelectric material (Q857511) (← links)
• Finite element simulation of stress intensity factors in elastic plastic crack growth (Q863859) (← links)
• Numerical studies on crack problems in three-layered elastic media using an image method (Q865147) (← links)
• The energy release rate of mode II fractures in layered snow samples (Q865178) (← links)
• On the fracture resistance of adhesively jointing structures (Q869233) (← links)