A three‐dimensional numerical method for thermal analysis in X‐ray lithography

DOI10.1108/09615539810213188zbMath0935.78017OpenAlexW1988190738MaRDI QIDQ4700816

Weizhong Dai, R. F. Nassar

Publication date: 9 May 2000

Published in: International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1108/09615539810213188

zbMATH Keywords

finite difference methodPoisson equationmultilayersphotoresistdomain decomposition algorithmpreconditioned Richardson methodmicrofabrication

Mathematics Subject Classification ID

Finite difference methods applied to problems in optics and electromagnetic theory (78M20) Technical applications of optics and electromagnetic theory (78A55) Finite difference methods applied to problems in thermodynamics and heat transfer (80M20)

Related Items (7)

A domain decomposition method for solving thin film elliptic interface problems with variable coefficients ⋮ Mathematical model and computer simulation of three dimensional thin film elliptic interface problems ⋮ A finite difference scheme for solving a three-dimensional heat transport equation in a thin film with microscale thickness ⋮ A compact finite difference scheme for solving a three-dimensional heat transport equation in a thin film ⋮ A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography ⋮ A preconditioned Richardson method for solving three‐dimensional thin film problems with first order derivatives and variable coefficients ⋮ An unconditionally stable finite difference scheme for solving a 3D heat transport equation in a sub-microscale thin film

Cites Work

• Preconditioned Chebyshev collocation methods and triangular finite elements
• A generalized Douglas ADI method for solving three‐dimensional parabolic differential equations on multilayers

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