A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography
DOI10.1108/09615539910276160zbMATH Open0953.80002OpenAlexW2078121970MaRDI QIDQ4952969FDOQ4952969
Authors: Weizhong Dai, Raja Nassar
Publication date: 29 January 2001
Published in: International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1108/09615539910276160
Recommendations
- A three‐dimensional numerical method for thermal analysis in X‐ray lithography
- 3-D finite element simulation of wafer thermal distortion and stress fields in exposure process
- A simulation system based on mixed-hybrid finite elements for thermal oxidation in semiconductor technology
- scientific article; zbMATH DE number 1998919
- Finite difference method and analysis for three-dimensional semiconductor device of heat conduction
thin layerstemperature profileblock tridiagonal linear systemsparallel Gaussian eliminationthree-dimensional parabolic equationsdomain decomposition algorithmthree-dimensional numerical method\(X\)-ray irradiation process\(X\)-ray lithographyhybrid finite element-finite difference scheme
Technical applications of optics and electromagnetic theory (78A55) Finite difference methods applied to problems in thermodynamics and heat transfer (80M20) Finite element, Galerkin and related methods applied to problems in thermodynamics and heat transfer (80M10) Thermodynamics and heat transfer (80A99)
Cites Work
Cited In (6)
- A three‐dimensional numerical method for thermal analysis in X‐ray lithography
- Mathematical model and computer simulation of three dimensional thin film elliptic interface problems
- Hybrid asymptotic-numerical modeling of thin layers for dynamic thermal analysis of structures
- An unconditionally stable finite difference scheme for solving a 3D heat transport equation in a sub-microscale thin film
- 3-D finite element simulation of wafer thermal distortion and stress fields in exposure process
- A finite difference scheme for solving a three-dimensional heat transport equation in a thin film with microscale thickness
This page was built for publication: A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q4952969)