A three‐dimensional numerical method for thermal analysis in X‐ray lithography

DOI10.1108/09615539810213188MaRDI QIDQ4700816zbMATH OpenOpenAlexFDO

Authors Weizhong Dai, Raja Nassar

Publication date 9 May 2000

Published in International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1108/09615539810213188

zbMATH Keywords

domain decomposition algorithmfinite difference methodmicrofabricationmultilayersphotoresistPoisson equationpreconditioned Richardson method

Mathematics Subject Classification ID

Technical applications of optics and electromagnetic theory (78A55) Finite difference methods applied to problems in optics and electromagnetic theory (78M20) Finite difference methods applied to problems in thermodynamics and heat transfer (80M20)

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Cites work

• A generalized Douglas ADI method for solving three‐dimensional parabolic differential equations on multilayers
• Preconditioned Chebyshev collocation methods and triangular finite elements

Cited in

(8)

• An unconditionally stable finite difference scheme for solving a 3D heat transport equation in a sub-microscale thin film
• 3D heat diffusion simulation using 3D and 1D heat sources-temperature and phase contrast results for defect detection using IRT
• A finite difference scheme for solving a three-dimensional heat transport equation in a thin film with microscale thickness
• Mathematical model and computer simulation of three dimensional thin film elliptic interface problems
• A preconditioned Richardson method for solving three‐dimensional thin film problems with first order derivatives and variable coefficients
• A compact finite difference scheme for solving a three-dimensional heat transport equation in a thin film
• A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography
• A domain decomposition method for solving thin film elliptic interface problems with variable coefficients

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