A three‐dimensional numerical method for thermal analysis in X‐ray lithography

DOI10.1108/09615539810213188zbMath0935.78017OpenAlexW1988190738MaRDI QIDQ4700816

Weizhong Dai, R. F. Nassar

Publication date: 9 May 2000

Published in: International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1108/09615539810213188

zbMATH Keywords

finite difference methodPoisson equationmultilayersphotoresistdomain decomposition algorithmpreconditioned Richardson methodmicrofabrication

Mathematics Subject Classification ID

Related Items (7)

A domain decomposition method for solving thin film elliptic interface problems with variable coefficients ⋮ Mathematical model and computer simulation of three dimensional thin film elliptic interface problems ⋮ A finite difference scheme for solving a three-dimensional heat transport equation in a thin film with microscale thickness ⋮ A compact finite difference scheme for solving a three-dimensional heat transport equation in a thin film ⋮ A hybrid finite element‐finite difference method for thermal analysis in X‐ray lithography ⋮ A preconditioned Richardson method for solving three‐dimensional thin film problems with first order derivatives and variable coefficients ⋮ An unconditionally stable finite difference scheme for solving a 3D heat transport equation in a sub-microscale thin film

Cites Work

• Preconditioned Chebyshev collocation methods and triangular finite elements
• A generalized Douglas ADI method for solving three‐dimensional parabolic differential equations on multilayers

This page was built for publication: A three‐dimensional numerical method for thermal analysis in X‐ray lithography